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100g NC-559-ASM 28um No Clean Solder Flux Paste - Lead-Free Tin Cream for Phone & Electronics Repair - Ideal for PCB Rework, Soldering, and BGA Reballing
100g NC-559-ASM 28um No Clean Solder Flux Paste - Lead-Free Tin Cream for Phone & Electronics Repair - Ideal for PCB Rework, Soldering, and BGA Reballing
100g NC-559-ASM 28um No Clean Solder Flux Paste - Lead-Free Tin Cream for Phone & Electronics Repair - Ideal for PCB Rework, Soldering, and BGA Reballing
100g NC-559-ASM 28um No Clean Solder Flux Paste - Lead-Free Tin Cream for Phone & Electronics Repair - Ideal for PCB Rework, Soldering, and BGA Reballing
100g NC-559-ASM 28um No Clean Solder Flux Paste - Lead-Free Tin Cream for Phone & Electronics Repair - Ideal for PCB Rework, Soldering, and BGA Reballing
100g NC-559-ASM 28um No Clean Solder Flux Paste - Lead-Free Tin Cream for Phone & Electronics Repair - Ideal for PCB Rework, Soldering, and BGA Reballing
100g NC-559-ASM 28um No Clean Solder Flux Paste - Lead-Free Tin Cream for Phone & Electronics Repair - Ideal for PCB Rework, Soldering, and BGA Reballing
100g NC-559-ASM 28um No Clean Solder Flux Paste - Lead-Free Tin Cream for Phone & Electronics Repair - Ideal for PCB Rework, Soldering, and BGA Reballing
100g NC-559-ASM 28um No Clean Solder Flux Paste - Lead-Free Tin Cream for Phone & Electronics Repair - Ideal for PCB Rework, Soldering, and BGA Reballing
100g NC-559-ASM 28um No Clean Solder Flux Paste - Lead-Free Tin Cream for Phone & Electronics Repair - Ideal for PCB Rework, Soldering, and BGA Reballing

100g NC-559-ASM 28um No Clean Solder Flux Paste - Lead-Free Tin Cream for Phone & Electronics Repair - Ideal for PCB Rework, Soldering, and BGA Reballing

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Description

Specification: Item Type: Flux Flux Type: NC-559-ASM Paste Weight: Approx. 100 g / 3.5 oz Granularity: 28 (um) Viscosity: 180 (Pa·S) Package List: 1 x Flux Soldering Paste: Widely used in clocks and watches, accurate parts, stainless steel crafts, tableware, mobile communications, digital products, air conditioning and refrigerator refrigeration equipment, glasses, knives, car radiators and various PCB boards and BGA solder balls Brazing

Features

    ➤【SUITABLE APPLICATION】-- Used in mobile phone PCB, BGA and PGA SMD rework solder paste and low ion system

    ➤【LOW SMOKE EMISSION】-- High tin running speed, low smoke emission, and high insulation on the after curing

    ➤【PREVENT OXIDATION】-- The high temperature of soldering is easy to oxidize the of the soldering material, and the solder paste helps prevent the oxidation process

    ➤【HIGH SOLDERING QUALITY】-- The tension of the substance will affect the quality of soldering, another function of the solder paste is to reduce the tension of the material

    ➤【EASY TO CARRY & STORE】-- Small size, easy to carry and store, convenient to use and with good performance

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