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Product Description Product Specification: Brand Name: Essmetuin Model Number: ZB-SBA30 Material: Tin\Bismuth\Silver Product name: Silver Solder Paste Net Weight: 30g Melting Point: 183℃ (361°F) Feature: High Thermal Conductivity And Conductivity Application: Electronics Soldering, PCB/IC/BGA/SMD CELLPHONE CPU Repairing Usages: Welding Tool BGA Planting Tin PCB Repair IC Chip
Lead-Free Solder Paste Content Tin 64% Bi 35%Ag1%, Solder Flux Content 10.0%
Electronics Soldering Paste - Low Temperature Solder Paste With Flux, Melting Point 183 ℃ (361F)
Product Advantages Pushing-Type Design Smoother Flowing No Wasting During Welding
Suitable For Paper Boards Or Soft Boards That Cannot Withstand High Temperatures, Special Welding Of Small Components
Widely Used In BGA /SMD Circuit Board, Motors, Lighting, IC, TV and Other Household Appliances And Electronics Soldering Industrial Equipment, Sensors, Wires, Fuses, Phone, Metal Shells, Motors, Lighting, Connectors, ,SMT Maintenance